kernel/drivers/thermal/qcom/tsens.c, branch linux-6.9.y

thermal/drivers/tsens: Fix null pointer dereference

2024-05-30T07:44:23Z

[ Upstream commit d998ddc86a27c92140b9f7984ff41e3d1d07a48f ] compute_intercept_slope() is called from calibrate_8960() (in tsens-8960.c) as compute_intercept_slope(priv, p1, NULL, ONE_PT_CALIB) which lead to null pointer dereference (if DEBUG or DYNAMIC_DEBUG set). Fix this bug by adding null pointer check. Found by Linux Verification Center (linuxtesting.org) with SVACE. Fixes: dfc1193d4dbd ("thermal/drivers/tsens: Replace custom 8960 apis with generic apis") Signed-off-by: Aleksandr Mishin Reviewed-by: Konrad Dybcio Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20240411114021.12203-1-amishin@t-argos.ru Signed-off-by: Sasha Levin

thermal: tsens: Convert to platform remove callback returning void

2023-09-29T10:34:17Z

The .remove() callback for a platform driver returns an int which makes many driver authors wrongly assume it's possible to do error handling by returning an error code. However the value returned is ignored (apart from emitting a warning) and this typically results in resource leaks. To improve here there is a quest to make the remove callback return void. In the first step of this quest all drivers are converted to .remove_new(), which already returns void. Eventually after all drivers are converted, .remove_new() will be renamed to .remove(). Trivially convert this driver from always returning zero in the remove callback to the void returning variant. Signed-off-by: Uwe Kleine-König Acked-by: Daniel Lezcano Signed-off-by: Rafael J. Wysocki

thermal/drivers/qcom: Remove redundant msg at probe time

2023-06-26T10:03:14Z

The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li Reviewed-by: Dmitry Baryshkov Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com

thermal/drivers/qcom/tsens-v0_1: Add MSM8909 data

2023-06-26T10:03:13Z

The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like MDM9607 it uses a non-standard default slope value of 3000 [1] and needs per-sensor "correction factors" to workaround issues with the factory calibration [2]. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476 [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911 Reviewed-by: Konrad Dybcio Reviewed-by: Dmitry Baryshkov Signed-off-by: Stephan Gerhold Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com

thermal/drivers/qcom/tsens-v0_1: Add mdm9607 correction offsets

2023-06-26T10:03:13Z

According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs "correction factors" to adjust for additional offsets observed after the factory calibration values in the fuses [1, 2]. The fixed offsets should be applied unless there is a special calibration mode value that indicates that no offsets are needed [3]. Note that the new calibration mode values are called differently in this patch compared to the vendor kernel: - TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET This is because close inspection of the calibration function [3] reveals that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration because the if statements skip all "point2" related code for it. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e [3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio Reviewed-by: Dmitry Baryshkov Signed-off-by: Stephan Gerhold Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com

thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226

2023-06-26T10:03:13Z

The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by: Matti Lehtimäki Reviewed-by: Dmitry Baryshkov Reviewed-by: Luca Weiss Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com

thermal/hwmon: Use the right device for devm_thermal_add_hwmon_sysfs()

2023-03-03T19:45:02Z

The devres variant of thermal_add_hwmon_sysfs() only takes the thermal zone structure pointer as parameter. Actually, it uses the tz->device to add it in the devres list. It is preferable to use the device registering the thermal zone instead of the thermal zone device itself. That prevents the driver accessing the thermal zone structure internals and it is from my POV more correct regarding how devm_ is used. Signed-off-by: Daniel Lezcano Acked-by: Martin Blumenstingl #amlogic_thermal Acked-by: Jernej Skrabec #sun8i_thermal Reviewed-by: AngeloGioacchino Del Regno #MediaTek auxadc Signed-off-by: Rafael J. Wysocki

thermal/core: Use the thermal zone 'devdata' accessor in thermal located drivers

2023-03-03T19:45:02Z

The thermal zone device structure is exposed to the different drivers and obviously they access the internals while that should be restricted to the core thermal code. In order to self-encapsulate the thermal core code, we need to prevent the drivers accessing directly the thermal zone structure and provide accessor functions to deal with. Use the devdata accessor introduced in the previous patch. No functional changes intended. Signed-off-by: Daniel Lezcano Reviewed-by: Niklas Söderlund #R-Car Acked-by: Mark Brown Reviewed-by: AngeloGioacchino Del Regno #MediaTek auxadc and lvts Reviewed-by: Balsam CHIHI #Mediatek lvts Reviewed-by: Adam Ward #da9062 Reviewed-by: Baolin Wang #spread Acked-by: Jernej Skrabec #sun8i_thermal Acked-by: Rafael J. Wysocki Acked-by: Florian Fainelli #Broadcom Reviewed-by: Dhruva Gole # K3 bandgap Acked-by: Linus Walleij Acked-by: Heiko Stuebner #rockchip Reviewed-by: Kunihiko Hayashi #uniphier Signed-off-by: Rafael J. Wysocki

thermal/drivers/qcom: Remove duplicate set next trip point interrupt code

2023-01-16T12:05:24Z

The tsens driver reprogram the next trip points in the irq handler. This function then call thermal_zone_device_update(). However, thermal_zone_device_update() calls thermal_zone_set_trips() and from there it calls the backend 'set_trips' ops. This one in turn reprogram the next trip points (low/high). Consequently, the code setting the next trip points interrupt in the interrupt handle is not needed and could be removed. Reviewed-by: Bjorn Andersson Acked-by: Amit Kucheria Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20230116101955.3961427-1-daniel.lezcano@linaro.org

thermal/drivers/tsens: Rework legacy calibration data parsers

2023-01-16T10:22:30Z

Rework existing calibration parsing code to use simple data structure describing data layout. This allows us to drop all the mask & shift values, replacing them with data tables. The code for msm8974 is not reworked, as it has separate calibration and backup data. Reported-by: kernel test robot Signed-off-by: Dmitry Baryshkov Link: https://lore.kernel.org/r/20230101194034.831222-12-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano